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PCB流程二
2014-12-24 13:52:27

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利用化学微蚀方式粗化铜面並用棕化药水在铜面生成一层氧化铜,增大铜导体与树脂的接触表面积增强结合力
Coarsen the surface by micro-etching and form copper oxide on the surface by brown solution,add the adhension between conductor and resin.

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将组合后之多层板与铜箔/PP进行叠合以利后续压合作业
Multilayers after combination should be lay up with copper foil and PP.

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将叠合好的待压板利用高温高压的方式熔合黏结成多层板
Multilayers after lay up should be bonded by high temperature and pressure.

將压合好之冊板与 lay up 相反程序拆出分开叠放.
Use the mark line to unload the finished laminition boards which is just oppsite with the lay up procedure and separate them one by one.

通过X-RAY /CCD对位系統抓取內層靶标,再利用高速运转的主軸配合钻头将其定位孔钻出
Get the target in inner layer by X-ray/CCD and drill location hole by drill bits and spindle with high speed.

利用捞边机将板边多余流胶去除。
Performing LM routing cut the useless flowed resin on the boards edge.

 

 

 
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