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PCB流程四
2014-12-24 11:04:58

采用卤素灯为光源,再配合光纤呈多方向照射,利用反射光和散射光來摄取影像后与原始资料对比进行缺点判定
Use halogen lamp as alluminant and shine in every directions.Get image data by reflected light and scattered light, and compare with initial data to judge the defect.

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去除铜面氧化物、杂质及油脂,清洁板面、粗化板面,增強防焊油墨与板面结合力与附着力
Remove the oxide、impurity and grease on the surface of PCB, then clean and coarsen the surface to add adhension between solder mask and surface.

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利用刮刀,借用一定的角度与压力推挤油墨,透过网版上网纱的缝隙,在板面上均勻的覆盖一层防焊油墨.
Push solder mask on the halftone with scrapers and coat the ink on the surface of the board through gaps on the halftones.

使印刷后防焊油墨內有机溶剂挥发,油墨初步固化, 以便于后续曝光制程作业
Cure the solder mask with PCB by evaporating organic solvent to ensure follow-up exposure.

利用紫外线的能量,让感光油墨中的光敏物质进行光化学反应,将底片上图像转移至板面上
Use the energy of UV light to transfer the image from film to surface of PCB by photochemical reaction.

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通过显影机將Na2CO3溶液喷洒在板面,利用药水和油墨之化学反应,将板面未发生光聚合反应的油墨沖洗掉.
Put sodium carbonate on the surface of boards by developer to remove the solder mask without photochemistry by chemical reaction between solution and solder mask .

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利用温度、时间等参数让油墨內的有机溶剂挥发,使油墨完全硬化。
Cure solder mask completely by evaporating the organic solvent with suitable temperature and time.

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利用刮刀,借用一定的角度与压力推挤油墨﹐透过网版上网紗的缝隙,在板面上印刷出相应的文字或字符
Push silk screen on the halftone with scrapers and coat the characters on the surface of the board through gaps on the halftones.

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根据文字油墨的特性,通过UV光或热风烘烤的方式对其进行固化。
Cure the ink on the board completely by UV light or baking according to speciality of printing ink.

将板面外框切掉或进行板內局部挖空机械作业以符合客戶之外型尺寸要求
Cut out panel profile,or shave part of board to meet the dimension requirment of customer

针对多个单元板连片出货设计之板,在各单元连接刻出V型凹槽,以利组装完成后各单元拆分作业;
Make a V-shape groove in the middle of  two or above units for breaking on back-end process process.

去除板面氧化以及成型与V-CUT后残留粉尘
Remove surface oxidation and  dust   after the Routing&v-cut

 

 

 
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